Sponsored whitepaper
Electronics Cooling Design Optimisation with Cloud-Native Multiphysics Simulation
Published Monday, October 11, 2021
Engineers who design and test electronics require high-fidelity engineering simulation to investigate heat and fluid flow in order to develop the best thermal management strategies. Access to physics-based solvers in the cloud can enable teams to quickly assess performance and accelerate design iterations by leveraging the power of cloud computing.
This whitepaper highlights the benefits of cloud-native engineering simulation and describes the fast and accurate analysis types available to engineering teams who simulate early in the design stages.
Key Learning Points:
- Common challenges faced by electronics designers constrained by traditional CAE
- How cloud computing enables teams to quickly assess performance and accelerate design iterations
- Enclosure, lighting, and Li-ion Battery pack cooling case studies using cloud-native physics solvers
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