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Predicting the thermal performance of electronic devices

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A variety of thermal management use examples and how high-tech companies, such as Huawei Technologies and the Large Hadron Collider team at CERN, use multiphysics simulation for making informed design decisions and better predicting electromagnetic system performance.

In this technical article the capabilities of simulation software for analysing heat transfer and multiphysics behaviour in devices are described through example use cases. The use of multiphysics simulation to study phenomena such as convective cooling, Joule heating and phase change is discussed.

Download this article to:

  • Learn how concurrent investigations of heat transfer mechanisms and factors in a system that cause temperature variations lead to a better understanding of the impact of design changes on a product’s performance.
  • Read how leading engineers use physics interfaces, couplings and postprocessing functionality of COMSOL Multiphysics® to study phenomena such as convective cooling, Joule heating, phase change and thermal expansion.
  • Explore how simulation applications allow for immediate adjustments of a design while streamlining communication between collaborators and increasing the number of people who can meaningfully contribute to a product. 

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