Fairchild and Infineon agree on MOSFET packaging
Infineon Technologies and Fairchild Semiconductor have agreed on a packaging partnership for their power MOSFETs that use the Infineon PowerStage 3x3 or Fairchild MLP 3x3 (Power33) packages.
“Standardising power packages benefits our customers as we minimise the amount of ‘unique’ packages available in the market place, while offering solutions that enhance performance levels in smaller form factors than the previous generations,” said Richard Kuncic, director and product line manager for low-voltage MOSFETs at Infineon.
“Fairchild and Infineon have standardised the pin-out and have complementing performance levels, offering customers two sources for their high efficiency design needs in the computing, telecom and server markets,” said John Bendel, Fairchild’s senior vice president of low-voltage products. “This package alignment is staged to deliver performance leading products in a multi-source, industry standard package.”