ST to have 40nm chips made by Globalfoundries
Globalfoundries has signed its first major customer outside parent AMD: STMicroelectronics will use the company’s Dresden fab to make parts based on a 40nm bulk silicon process.
First tape out and production of ST products by Globalfoundries is planned to start in 2010.
“When we launched Globalfoundries, our long-term vision was to bring a new business model to the foundry market and to become the partner of choice for the largest and most innovative semiconductor design and manufacturing companies,” said Doug Grose, CEO of Globalfoundries. “With the addition of an industry-leader in low-power technology like STMicroelectronics we now begin to deliver on this vision.”
Jean-Marc Chery, chief technology officer at ST: added that the deal is intended to provide capacity on leading-edge processes: “ST needs an agile and high-performance manufacturing partner that can adapt to our changing needs. We believe Globalfoundries is an excellent partner to collaborate on low-power design innovation in 2010 and beyond.”
Earlier this month, Globalfoundries broke ground on Fab 2, a $4.2bn wafer manufacturing facility in Malta, New York.