Foundry introduces 3D process for sensors

Austria Micro Systems’ foundry business has introduced a through silicon via (TSV) process, aimed at users who want to put sensors into 3D chip stacks.

With the TSV technology chips from two 8in wafers can be joined and electrically connected through vias that run from one wafer to the other.

With typical TSV depths of 200µm to 300µm, the process can support different wafer thicknesses. A back side re-distribution layer concept enables various front and back-side I/O pad connections.

“This new 3D integration technology further extends our portfolio of mixed-signal analogue and high-voltage technologies and provides customer-specific solutions for sensor integration. The innovative TSV technology can be combined in a fully flexible manner with any of our 0.35µm analogue specialty technologies,” said Thomas Riener, general manager of the foundry business unit at Austria Micro Systems.

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